According to foreign media reports, although graphene is only as thick as one atom, its strength must be heard by everyone, but is there any way to make it stronger? –Turn it into pieces of diamonds. Researchers in South Korea have now developed a way to convert graphene into the thinnest diamond film without the use of high pressure.
Graphene, graphite and diamond are all made of the same material-carbon-but the difference between these materials lies in the arrangement and combination of carbon atoms. Graphene is a carbon layer with a thickness of only one atom, with strong horizontal bonds between them. Graphite is composed of graphene sheets stacked one after another. Each layer has strong bonds inside, and different layers are connected by weak bonds. In diamond, carbon atoms are closely connected in three-dimensional space to form an incredibly hard material.
When the bond between graphene layers is strengthened, it becomes a 2D form of diamond called diamane. The problem is that it is usually very easy to do. One of these methods requires extremely high pressure. Once the pressure disappears, the material will be reduced to graphene. Other studies require the addition of hydrogen atoms to graphene, but this makes it difficult to control the bonds.
In this new study, researchers at the Institute of Basic Science (IBS) and Ulsan National Institute of Science and Technology (UNIST) replaced hydrogen with fluorine. Their idea is to expose the two layers of graphene to fluorine atoms, in this way to make the two layers of graphene closer together to form a stronger chemical bond.
The research team first used the reliable method of chemical vapor deposition (CVD) to prepare double-layer graphene on copper and nickel substrates. Then they exposed the graphene to the vapor of xenon difluoride. At this time, the fluorine atoms in the mixture will adhere to the carbon atoms, thereby strengthening the bonding between the graphene layers and forming a layer of ultra-thin fluorinated diamond, namely F-diamane.
The new process is much simpler than other processes in the past, which should make it relatively easy to expand. Ultra-thin diamond can be made into stronger, smaller, and more flexible electronic components, especially as a wide gap semiconductor.
Pavel V. Bakharev, the lead author of the study, pointed out that this simple fluorination method can work at close to room temperature and low pressure without the use of plasma or any gas activation mechanism, so this greatly reduces the possibility of defects.
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